Flexible Printed Circuit
FPC is the short term of Flexible Printed Circuit. Flexible Printed Circuit (FPC) is made on flexible dielectric substrates, like various Polymeric materials therefore it has properties of lightweight, soft, thinness, smallness, ductility, flexibility and high wiring density. It can be easy to bend, fold, wind and flex in 3D space to reduce electronic device size and weight therefore it is widely used creating products that are complex, compact and lightweight.

Advantages of FPC:
FPC (Flexible Printed Circuit) is made on flexible dielectric substrate, has many unique advantages compared with hard printed circuit:
1) Easy to bend, fold, wind and flex in 3D space, therefore it can be integrative with components and leads.
2) Largely reduce electronic products size and weight, meeting the requirements for high wiring density, reliability and miniaturization. So it has been widely used in spaceflight, military, mobile communication, portable computer, computer peripheral equipments, PDA, digital camera, etc.
3) Good heat dissipation, weld ability, and connectivity, low composite cost and new combination of flexible and hard which fill the lack in carrying capacity of flexible material.